Mold-Tek Packaging Ltd Partly Paidup

Outcome of the meeting of the Committee of Directors (Rights Issue) (the Committee) of Mold-Tek Packaging Limited (the Company) held on 9th November 2021 in relation to Receipt of first and final call money on partly paid-up equity shares of the Company and its transition into fully paid -up equity share pursuant to the Rights Issue and the Letter of Offer dated 17th October 2020.