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Chip packaging units need to tie up with customers upfront to ensure there’s a buyer for their output
8 min read Last Updated : Jun 03 2025 | 7:12 PM IST
In the semiconductor industry, assembly, testing, marking, and packaging (ATMP) and outsourced semiconductor assembly and test (OSAT) are the final, critical phases before chips are shipped to diverse users — smartphones, laptops, automotive, consumer electronics, and other product manufacturers.
These processes contribute 12–15 per cent of a chip’s total value. In India’s budding semiconductor landscape, this is where the action is. Government-backed initiatives, at both central and state levels, are kickstarting chip manufacturing from the finish line, establishing ATMP/OSAT units led by tech giants and strategic alliances — alongside one fabrication plant by Tata Electronics.
More than $21 billion worth