The platforms, BSE-BOND and NSE-EBP (Electronic Debt Bidding Platform), facilitate online bidding for private placement of debt securities.
The first placement of bond through BSE BOND was raised by HDB Financial Services with an issue size of Rs 100 crore, which was fully subscribed. HDFC Bank acted as an arranger to the issue, BSE said in a statement.
Separately, NSE said it has recorded its first deal with LIC Housing Finance raising around Rs 435 crore through the newly launched platform. The bidding window was open for 30 minutes.
This initiative will help in the development of corporate bond market and is aimed at enhancing transparency and efficiency in the price discovery in the debt private placement market.
It will be optional for the issues below Rs 500 crore but the issuers will have to disclose coupon, yield, amount raised, number of investors and category of investors to the Electronic Book Provider or to the information repository for corporate debt market, in the format as specified by Sebi.
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