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PC chip major Intel CEO Lip-Bu Tan is likely to visit Odisha later this year for the ground-breaking ceremony of 3D Glass Solutions' semiconductor plant, a senior state government official said on Wednesday. The ground-breaking ceremony of the silicon carbide company SicSem is scheduled for next month, and the commercial production of chips is expected to start in two years, Odisha Electronics and IT Department Principal Secretary Vishal Kumar Dev told PTI. "Chief Minister (Mohan Charan Majhi) was here, and they (SiCSem and 3DGS) have given a commitment to start the unit soon. SiCSem's ground-breaking will be done next month, and the other company, 3D Glass Solutions (3DGS), they are looking for a date from Intel CEO Lip-Bu Tan. He plans to visit Odisha also. That is when the ground-breaking will happen. Hopefully, in the next two to three months," Dev said. 3D Glass semiconductor packaging unit to be set up by Heterogeneous Integration Packaging Solutions Pvt Ltd, which is backed
Intel India and the government's IndiaAI mission have joined hands to launch an initiative focused on bolstering AI capabilities and skills nationwide. The partnership, formalised through a Memorandum of Understanding (MoU), aims to empower young individuals, professionals, startups, and public sector leaders, enabling them to leverage AI's potential for societal advancement and effective governance. "The MoU outlines a framework for cooperation between Intel India and IndiaAI Mission to drive focused initiatives that will enable students, startups, and public sector leaders to develop and apply AI skills and competencies for social impact and good governance," a company statement said. The collaboration will focus on four key programmes: YuvaAI, StartupAI, IndiaAI Dialogues, and enabling Bhashini for scaling to remote regions. YuvaAI, through the Intel AI for Youth programme, will enable school students to develop AI-enabled solutions with social impact. StartupAI will support AI