Tuesday, March 31, 2026 | 01:16 PM ISTहिंदी में पढें
IZMO Ltd News
Izmo shares jump 5% as arm develops 3D SiP module for space electronics
By using advanced "3D stacking" technology, Izmo re-engineered a standard 200mm x 200mm electronics board into a compact 81mm x 81mm module-an 84 per cent reduction in footprint.
 "Izmo shares jump 5% as arm develops 3D SiP module for space electronics")
Updated On : 12 Jan 2026 | 1:37 PM IST
Izmo rises 4% on company's plans to expand into semiconductor packaging
Izmo has outlined a "dual-engine" expansion strategy that uses its profitable automotive SaaS and digital businesses to fund a scale-up in advanced semiconductor packaging
 "Izmo rises 4% on company's plans to expand into semiconductor packaging")
Updated On : 01 Dec 2025 | 1:16 PM IST