Mold-Tek Packaging revises record date for interim dividend
Record date is 11 April 2017
Mold-Tek Packaging has revised the record date for payment of interim dividend for FY 2017 to 11 April 2017 instead of 07 April 2017.Powered by Capital Market - Live News
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First Published: Mar 29 2017 | 8:55 AM IST