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Huawei testing Kirin 990 chip, may debut in Q1 2019

IANS  |  Beijing 

Chinese is working on its next "Kirin 990" chipset with the (TSMC) which is likely to be unveiled in the first quarter of 2019, the media reported.

The processor would feature the second-generation 7nm process and is likely to debut as the first from the company.

"Industry chain sources claim that has already started working on the Kirin 990 SoC. The cost of testing the Kirin 990 chipset is very expensive. Each test requires an investment of around 200 million yuan," Gizmo China reported on Friday.

The processor is expected to arrive with "Balong 5000 5G" modem.

"The more advanced that will be used to manufacture the Kirin 990 offers 20 per cent increased transistor density, 10 per cent reduced power consumption, and 10 per cent improved overall performance compared to the chipsets built using the first-generation 7nm chipset from TSMC," The Headlines reported.

The launched its at IFA in in August that powers its flagship devices. The chipset is scheduled to debut in the Indian market in the fourth quarter of this year.

The first to be powered by the chipset is from the Mate 20 series which was launched in last month.

is the "world's first" SoC to sport a modem that supports LTE Category 21 which supports a downlink of 1.4Gbps, said.

--IANS

ksc/na/bg

(Only the headline and picture of this report may have been reworked by the Business Standard staff; the rest of the content is auto-generated from a syndicated feed.)

First Published: Sat, November 10 2018. 17:54 IST
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