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Mold-Tek Packaging to hold board meeting

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Capital Market

On 19 November 2014

Mold-Tek Packaging will hold a meeting of the Board of Directors of the Company on 19 November 2014, to discuss about various projects including setting up of new Plants and expanding IML- Capacities, and to discuss and finalise ways and means of raising Funds / Loans.

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First Published: Nov 17 2014 | 10:17 AM IST

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