Mold-Tek Packaging to hold board meeting
On 19 November 2014
Mold-Tek Packaging will hold a meeting of the Board of Directors of the Company on 19 November 2014, to discuss about various projects including setting up of new Plants and expanding IML- Capacities, and to discuss and finalise ways and means of raising Funds / Loans.Powered by Capital Market - Live News
Don't miss the most important news and views of the day. Get them on our Telegram channel
First Published: Nov 17 2014 | 10:17 AM IST