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Board of Mold-Tek Packaging to consider proposal for issue of shares/warrants on rights basis

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Capital Market

On 21 September 2020

The Board of Mold-Tek Packaging will meet on 21 September 2020 to consider and approve a proposal to issue equity shares/warrants to existing shareholders on Rights basis as may be permitted by under applicable law, subject to regulatory/ statutory approvals as may be required.

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First Published: Sep 17 2020 | 9:12 AM IST

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