Mold-Tek Packaging - Board to consider Dividend
On 15 May 2013
The board meeting of Mold-Tek Packaging will be held on 15 May 2013, to consider the interim dividend and recommend dividend for the financial year 2012-2013.Powered by Capital Market - Live News
Don't miss the most important news and views of the day. Get them on our Telegram channel
First Published: May 10 2013 | 2:36 PM IST