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Dixon Technologies signs MoU with Rexxam Co.

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Capital Market
Dixon Technologies (India) has entered into MOU with Rexxam Co., to form a Joint Venture company in order to apply for Govt of India's Production Linked Incentive (PLI) Scheme for manufacturing of Printed Circuit Boards for Air Conditioners (PCB) for domestic and international market.

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First Published: Aug 10 2021 | 10:37 AM IST

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